FiRa® Consortium Announces Core 4.0 Specification and Certification Program
This marks a major milestone for UWB technology, aligning with IEEE 802.15.4-2024 to meet FiRa-defined use cases.
Key updates in FiRa Core 4.0:
UL-TDoA – Enables asset tracking (UL-TDoA tags) using an infrastructure of positioning anchors, ensuring interoperability between tags and infrastructure. Optimized for tag simplicity and power efficiency, with flexible deployment options.
Paused Ranging – Suspends two-way ranging (TWR) while keeping devices synchronized, allowing fast reconnection when resuming sessions.
Aliro UWB support in UCI – Updates the UCI to test Aliro UWB features defined by the Connectivity Standards Alliance.
Additional improvements, extensions, and maintenance updates.
FiRa Core Certification Program 4.0 ensures interoperability for FiRa-enabled devices, driving adoption and innovation across industries. The program covers PHY, MAC, link layer, and interoperability testing.
FiRa 3.0 introduced the CCC Digital Key UWB PHY test for the first time, providing clear technical standards for automakers and key suppliers.
FiRa 4.0 achieves key collaboration with the Connectivity Standards Alliance (CSA), breaking down ecosystem barriers and accelerating large-scale digital key deployment. FiRa 4.0 also refines test configurations from version 3.0 and imposes stricter requirements on frequency and clock offsets.
The WELZEK T6290F performed excellently in FiRa 4.0 testing and has passed all test items.
FiRa 4.0 continuously raises test criteria – not as an excessive technical demand, but to address the core need for large-scale UWB adoption. As UWB penetration grows in digital keys, passive entry, smart home connectivity, and more, device interoperability has become the key bottleneck for ecosystem deployment.
WELZEK T6290 Series – One Tester for Whole-Vehicle Wireless Signal Testing
The T6290F supports not only UWB but also RF test metrics for 2G/3G/4G/5G, Bluetooth 6.0, Wi-Fi 7, and StarFlash in automotive electronics. With continuously expandable capabilities, new test requirements are met via simple software upgrades – significantly reducing iteration costs.
The smart automotive产业链 involves chips, modules, terminals, and platforms. The T6290 series offers broad applicability and high adaptability, providing professional test support across R&D and production phases.
